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Autocatalytic Coatings & Technology |
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Stapleton Technologies Inc. |
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MICRO Sequences |
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Hydrogen |
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40um Blind hole copper with nickel gold metalization |
CMOS Palladium Activation of Copper |
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This process sequence uses an ultra pure Palladium source to prepare a CMOS grade process used to deposit a thin layer of palladium onto copper. The process uses a displacement reaction by replacing the less noble copper with a deposit of palladium. The process chemistry used in this sequence is CMOS grade and contains less than 1 ppm Na and K for all pretreatment chemistries and less than 10ppm in the working metalization processes. |
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Process Materials |
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Process |
Description |
Technical Data Sheet |
Material Safety Data Sheet |
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MICRO 209 |
Cleaner, TMAH |
MICRO 209 DS |
MICRO 209 MSDS |
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MICRO 210 |
Cleaner, Organic Acid |
MICRO 210 DS |
MICRO 210 MSDS |
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MICRO 212 |
Cleaner, Organic Acid + HF |
MICRO 212 DS |
MICRO 212 MSDS |
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MICRO 214 |
Palladium Activation |
MICRO 214 DS |
MICRO 214 MSDS |
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MICRO 282 |
Autocatalytic Nickel |
MICRO 282 DS |
MICRO 282 MSDS |
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MICRO 290 |
Immersion Gold |
MICRO 290 DS |
MICRO 290 MSDS |
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MICRO 291 |
Hybrid Autocatalytic Gold |
MICRO 291 DS |
MICRO 291 MSDS |